Vatican acdc power module potting requirements(1)
The potting of the acdc power module is very important. This process not only involves the protection of the power module potting acdc power module (waterproof, moisture-proof, dust-proof, anti-corrosion, etc.), but also involves the protection of the power module. thermal design.
In the early 1980s, the research on the distributed high frequency switching power supply system basically focused on the research of the converter parallel technology. In the mid-to-late 1980s, with the rapid development of high-frequency power conversion technology, various converter topologies appeared one after another. Combined with large-scale integrated circuit and power component technology, it became possible to integrate small and medium power devices, thereby rapidly Promote the development of distributed high-frequency switching power supply system research. Since the late 1980s, this direction has become a research hotspot in the international power electronics field.
Commonly used power module potting materials are divided into three categories: epoxy resin, polyurethane and silicone rubber
Epoxies cannot be used for stress-sensitive and module sealing due to their hardness and are basically eliminated by module power supplies. However, due to its low cost, this epoxy is still used in cost-sensitive micropower supplies. Some domestic bad 48V input power supply manufacturers also use this epoxy resin acdc 48V input power supply module. However, due to stress problems, the failure rate of this 48V input power supply is very high, and buyers are miserable.